Microstructure Diagnostics

We provide comprehensive electrical contact evaluation, custom process characterization, and root cause analysis services for defects, especially electrical circuitry, to improve the performance and reliability of your systems.


© Fraunhofer CSP
The function, mode of operation and condition of the interconnection in the module can be detected and classified non-destructively.
© Fraunhofer CSP
The causes of large-area properties in the module often depend on the microstructure.
Quantification of structure, size and composition by analytical electron microscopy is essential for the robust evaluation of contact systems.

Material-property Correlations

  • Broad portfolio of non-destructive testing methods
  • Power measurement, EL, thermography, current flow imaging, X-ray technology (2D and 3D) as well as optical and ultrasonic microscopy
  • Correlation of properties with material analysis and physical simulation





Inspection over Several Dimensions (Multiscales)

  • High resolution of smallest structures in the module
  • Characteristics: Detection, classification and localization
  • Sample extraction from large components




Analytical Microstructure Analysis

  • Preparation portfolio for artifact-free target preparation down to µm range - basic requirement for reliable measurement results
  • Measurement of structure, size and chemical composition
  • Measurement methods: SEM/FIB, TEM, EDX, EBIC, AFM, XPS, TOF-SIMS, Raman, FTIR

© Fraunhofer CSP
Conductive adhesives for contact formation by means of a low-temperature process for temperature-sensitive solar cells or as an alternative to the classic soldering process.
© Fraunhofer CSP
With the detection of manufacturing defects, material analysis enables root cause identification and process improvement.
From the material analysis of an aging process, conclusions are drawn about causes for future improved quality assurance.

Support of Module Development

  • Status assessment of electrical contacts
  • Recognize process influences
  • Understanding contact formation
  • Improve resource efficiency






Manufacturing Defects

  • Detect and classify defects
  • Identify defect causes and mechanisms
  • Sustainable avoidance







Aging of Contacts and Interconnections

  • Consequences of contamination, delamination and chemical reaction
  • Corrosion in contacts, interconnections and connector pairs