Industry-oriented innovative wafer manufacturing technology with modern mechanical and chemical analytics and simulation.
- Optimization of the separation and cleaning processes for multicrystalline and monocrystalline wafers derived from modern multi-wire sawing technologies
- Analysis of the strength and breakage of wafers and solar cells to optimize processing and handling steps
- Process development for maskless plasma texture without ion bombardment and passivation
- Highly sensitive quantitative determination of organic and metallic contaminations