Competencies

 

Sensor-Supported
Wafer Production

 

Moth-Eye Structures

Plasma etching and texturing of silicon to remove saw damage and reduce surface reflectance.

Black SiN

 

Silicon Carbide Wafer Production

Finite Difference Method in the Time Domain

Time and spatially resolved simulation of reflection, transmission and absorption of electromagnetic waves in interaction with nanostructures.

Characterization of Functional Layers

Characterization of functional layers by QSSPC, C-V, Kelvin and FTIR measurements as well as the determination of global reflectance, transmittance and absorption.