sawing process
© Fraunhofer CSP
Supervising the characterization of the sawing process.
plasma enhanced chemical vapor deposition
© Fraunhofer CSP
Activating the apparatus for plasma enhanced chemical vapor deposition (PECVD).
  • Charge carrier service life and resistance measurement on blocks | SemiLab WT-2000P
  • IR radioscopic system for the identification of SiC/SiN inclusions in blocks | Intego FRA 1307
  • Surface and bevel grinding | Arnold type 72/860 and type 72/852, Okamoto type SIG 154 H
  • Cutting and squaring of mono- and multicrystals | Meyer Burger BS805
  • Wafer production (industry standard) | Meyer Bruger DS264, Meyer Burger DS265 (sensor monitoring)
  • Inline wafer cleaning (industrial standard) | Schmid type 64, Schmid type 58
  • Inline measuring system with sorting unit for wafer end control and classification | Hennecke Type He-WI-03
  • Media consumption measurement (power and cooling) | Johnson Controls and FRAKO


  • Plasma assisted chemical vapor deposition I Oxford Instruments Plasmalab 65
  • Plasma etching system I Oxford Instruments Plasmalab ICP 65
  • Reflectance measurement I Perkin Elmer Lambda 1050
  • Kelvin probe I tbd
  • Langmuir probe I Impedans
  • C-V measuring station I tbd
  • QSSPC I Sinton Instruments WCT-120