The wafering process can be optimized in many ways. Both empirical sawing tests and individual concept tests are possible. The multi-wire saws of Fraunhofer CSP (Meyer Burger DS264 & DS265) were equipped with force sensors especially for research into the influence of process parameters and consumables with the help of as few sawing tests as possible. This allows us to determine the interaction between the wire and the workpiece in order to obtain the greatest possible informative value from a single sawing test. The load curve is recorded over the entire sawing time. Based on this process data, statements can be made about the wire and cooling lubricant performance as well as the optimum of the process parameters. The figure shows workpiece carriers which have been modified using force sensors.