Fraunhofer Center for Silicon Photovoltaics CSPAssessment of Wafering Performance - What is the Best Sawing Method?
In order to be able to continue reducing production costs while maintaining product quality at the same time, the improvement of each individual process step is the main concern in the photovoltaic industry. A new method for the analysis of the sawing process, which is based on the evaluation of large amounts of data, data generated by the production machines and wafer specification, was developed at Fraunhofer CSP. With the developed method the correlation between sawing technology and wafer quality can be quantified. In addition, new parameters were defined to make it easier to detect the influence of process parameters and to measure the sawing performance of the saw wire without losing sight of the wafer quality. The figure shows the sawing performance of various sawing technologies and wires.
- „Advanced Analysis of Multi Wire Wafering Processes“, 44th IEEE Photovoltaic Specialists Conference (PVSC-44), Washington D.C. (U.S.A.), 2017
- "Advanced Analysis of Multi Wire Sawing Processes and Wire Performance Detection", EU PVSEC 2017 33rd European Photovoltaic Solar Energy Conference and Exhibition, Amsterdam (Netherlands), 2017