Wafer 4.0

In times of digitalization the acquisition of process data by production machines themselves is already standard in all industrial sectors. The aim of the Wafer 4.0 ctivities is therefore to implement a major expansion of process measurement technology.


Saw Performance from
Process Data Analysis

The improvement of every single process step is the main concern in the PV industry in order to further reduce production costs while maintaining product quality. At Fraunhofer CSP a new methodology for the analysis of the sawing process has been developed, which allows the evaluation of large amounts of data generated during the wafer specification process.


Live Process Forecasting

Through intelligent data analysis it is possible to predict process sequences. With the help of time series analyses, successful processes can be separated from unsuccessful ones. Thus it is possible to correct running processes to ensure stable processes and constant product quality.